系統(tǒng)應(yīng)用工程師AE 20-30萬(wàn)
合肥某半導(dǎo)體有限公司
所屬部門:深圳 匯報(bào)對(duì)象:負(fù)責(zé)人
大專以上 語(yǔ)言能力不限 26 歲-35 歲 3 年工作經(jīng)驗(yàn) 性別不限
投遞簡(jiǎn)歷
系統(tǒng)應(yīng)用工程師AE20-30萬(wàn)
合肥某半導(dǎo)體有限公司
所屬部門:深圳 匯報(bào)對(duì)象:負(fù)責(zé)人
大專以上 語(yǔ)言能力不限 26 歲-35 歲 3 年工作經(jīng)驗(yàn) 性別不限
投遞簡(jiǎn)歷
職位描述
職責(zé)描述:
1. IC HW function & PHY characteristic validation 
- Co-work with Analogue & Digital engineers to use relative equipment to check design circuit, function, PHY characteristic and debugging. 
- PCI-e, and Flash I/O electrical physical layer verification and compliance test. 
- Optimize IC parameter on modular and PCBA
2. PCB design/implement: 
- FPGA, EVB, Reference design, COB, tester PCB, MP tool PCB, and substrate design/implement/verification/debugging. 
- Layout review & create layout guide.
- IO/PCB/SBT circuit simulation and model build up.
- SI and PI measurement
3. RMA analysis and solution implement 
- Design in, Design win, test fail analysis and provide FAR report.
- Technical support for key customers. 
- Failure analysis for Module/Package IC product return.
4. Applicate note & document
- Layout guideline
- Reference design guideline
- EVB guideline
- BOM
- Die information
任職要求:
1. Familiar with OrCAD, Allegro, Package designer, PA, Scope, multi-mter, etc.
2. Basic understanding of storage controller or NAND technology is a plus.
3. Good understanding of SSD and strong failure analysis skill.
4. Good soldering skill.
5. Good High speed ckt concept and Multi-die ckt design experience is a plus.
6. Good automatic measurement build up experience is a plus.
企業(yè)介紹
開發(fā)的產(chǎn)品主要為快閃存儲(chǔ)器控制芯片,如:高端eMMC、UFS和PCIe SSD 等產(chǎn)品,同時(shí)將人工智能、邊際運(yùn)算以及物聯(lián)網(wǎng)的應(yīng)用積成在存儲(chǔ)器芯片內(nèi)。
工作地址
深圳
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